发明名称 POWER SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a power semiconductor device which is high in long-term reliability and restrained from deteriorating in withstand voltage performance particularly after it is subjected to a heat cycle test by a method wherein an insulating substrate is enhanced in withstand voltage characteristics. SOLUTION: A coating film 4 is made to contain inorganic particles so as to be lessened in thermal expansion coefficient, whereby the coating film 4 is lessened from varying in volume in a heat cycle. At the same time the relative dielectric constant of the coating films4 is set close to that of an insulating board 1, or silicon carbide which shows non-linear resistance is used as the inorganic particles so as to relax an electric field around an electrode. By this setup, a power semiconductor device excellent in withstand voltage characteristics can be provided.
申请公布号 JPH11297869(A) 申请公布日期 1999.10.29
申请号 JP19980095762 申请日期 1998.04.08
申请人 MITSUBISHI ELECTRIC CORP 发明人 HASEGAWA TAKETOSHI;MATSUDA SADAMU
分类号 H01L23/12;H01L23/02;H01L23/04;(IPC1-7):H01L23/04 主分类号 H01L23/12
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