| 摘要 |
PROBLEM TO BE SOLVED: To prevent stress from exerting even if a very small foreign matter exists on the semiconductor surface, by forming a part projecting from the semiconductor device surface to form a structure having a small area contacting the surface, when the semiconductor device is retained. SOLUTION: It is composed of pads 1, protection film 2 and thick protection film 3 formed on the peripheral surface of the semiconductor device. A partial protrusion is provided on the protective film of the semiconductor surface to avoid directly contacting a pickup jig to other than the semiconductor device periphery surface. If an Si piece or dust lie on other part then the periphery, the jig never presses there. Thus the semiconductor device surface is not nicked and defects due to wrong handling can be lessened. |
