| 摘要 |
PROBLEM TO BE SOLVED: To reduce the manufacturing cost of a semiconductor device to the same level as that of the conventional SOP/QFP type resin-sealed semiconductor package and, at the same time, to increase the packaging density of the device to the same density as that of lead-less semiconductor device. SOLUTION: A resin sealed semiconductor package 18 has no outer lead. In the package 18 in which a semiconductor chip 15 is sealed with a resin in a package, in other words, the bottom and side faces of inner leads 12 are exposed from a molded resin section 17 and connected to the wiring pattern of a printed wiring board 19 through solder layers 20. Namely, the bottom and side faces of the inner leads 12 exposed from the molded resin section 17 function as the external connecting terminals of the resin sealed semiconductor package 18. |
