SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To prevent a semiconductor device composed of transistor units or a pair of transistor units from oscillating, and to detect a bonding failure through a DC manner without making an RF selection in the semiconductor device where gate pads or drain pads are connected together. SOLUTION: In a semiconductor device possessed of transistor units or pairs of transistor units, the gate pads 221 of adjacent transistor units are connected together with a gate lead-out electrode connection wiring 23 possessed of a resistor 27 of resistance 0.6 to 10 Ω. Furthermore, the drain pads 211 are connected together with a drain lead-out electrode connection wiring 241.