| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which is excellent in thermal stability and almost kept free from cracks in a high-temperature thermal treatment such as a reflow process. SOLUTION: A board 1 is formed of liquid crystal high-molecular material, a semiconductor device 3 is mounted on the board 1, leads 6 and electrodes 7 are connected together, and a sealing material 8 is formed so as to cover joints 9 and the semiconductor device 3. The board 1 is prevented from absorbing moisture by liquid crystal high-molecular material very low in moisture- absorption characteristics. By this setup, a semiconductor package of this design can be protected against cracking caused by moisture absorbed in it in a high- temperature thermal treatment.
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