| 摘要 |
PROBLEM TO BE SOLVED: To reduce parasitic components by shortening the length of an electric wiring. SOLUTION: In a memory module 10, a chip 11 on whose main surface plural bumps 12 are projected is butted and fixed to the main surface of a holder 13 formed like a rectangular plate at the opposite side to the bump 12 group, and right and left parts 16 and 15 to be held are formed on the both short sides of the holder 13. An outside storage device is mounted by arranging the plural memory modules 10 on a wiring substrate, and holding the parts 16 and 15 to be held by holding parts. Thus, the outside terminal of a memory module can be constituted of each bump itself, and the parasitic capacity or inductance of the memory module can be excluded. Also, the distortion of an electric signal waveform can be suppressed in the outside storage device using the memory module. |
