ELECTRONIC ASSEMBLY AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To provide an electronic assembly having an insulating metallic heat sink and a method for manufacturing the assembly. SOLUTION: An electronic assembly 20 is provided with a heat radiating plate 11, a dielectric material 12, and a conductive layer 13. A semiconductor chip 21 is attached to an insulating metallic heat sink 10. The heat generated from the chip 21 is transferred to the convection surface 16 of the heat radiating plate 11 through the conductive surface 14 of the plate 11. A fluid is guided by a manifold 31.