| 摘要 |
PROBLEM TO BE SOLVED: To surely inspect a vacuumed solder ball, even if it is a fine solder ball or an extra ball in a state, in which it is hung just below the normally vacuumed solder ball by variably inspecting the vacuum state of the solder ball with a two-dimensional CCD camera and a line sensor. SOLUTION: A two-dimensional CCD camera 3 is installed on the moving route of a vacuum head 5 so that the solder ball vacuum face of the vacuum head 5 is recognized. A line sensor 4 constituted of a light projection part 12 projecting a line-formed light 13 from a side, so that it follows the vacuum face from the lower part of the vacuum head 5 at prescribed width and a light reception part 14 detecting light facing the light-projecting part 12 is installed. The planar image of the solder ball vacuum face is read and inspected by the two-dimensional CCD camera 3. The line sensor 4 reads and inspects the light reception result of prescribed width from the vacuum face. Only when two inspections are correct, will the solder ball vacuum head 5 be moved to a ball loading process. |
