发明名称 METHOD FOR EVALUATING UNWINDING PERFORMANCE OF THIN BONDING METAL WIRE OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To evaluate unwinding performance of a thin bonding metal wire conveniently and objectively by turning a spool to unwind a thin metal bonding wire sequentially and then inspecting the unwinding state thereof. SOLUTION: A thin metal wire 4 wound around a spool 3 is fixed to a spool holder and then the spool 3 is turned in a windshield container 8 to unwind the thin metal wire 4. The unwound thin metal wire 5 drops with the self-weight thereof. When the thin metal wire 5 is unwound smoothly, it is not detected by a sensor 9 but when abnormality occur, e.g. the thin metal wire is caught, it is detected by the sensor 9. When the spool 3 is turned continuously, abnormality is eliminated and the thin wire is unwound again smoothly. Unwinding performance is evaluated by measuring the number of detection times of the sensor 9.
申请公布号 JPH11297744(A) 申请公布日期 1999.10.29
申请号 JP19980102795 申请日期 1998.04.14
申请人 TANAKA ELECTRONICS IND CO LTD 发明人 IGA SUKEHITO
分类号 H01L21/60 主分类号 H01L21/60
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