A METHOD OF CHEMICAL MECHANICAL POLISHING A METAL LAYER

摘要

In the formation of metal vias, plugs or lines, a metal layer (18) is deposited onto a non-planar non-metallic surface of a substrate (10). The metal layer (18) is chemical mechanical polished with a first polishing pad (100) until the metal layer (18) is substantially planarized and a residual layer (19) having a thickness about equal to the depth of potential microscratches (120), between about 200 and 1000 angstroms, remains over the non-metallic surface (14). The residual layer (19) is chemical mechanical polished with a second, softer polishing pad (110) until the non-metallic surface (14) is exposed.