| 摘要 |
PROBLEM TO BE SOLVED: To reduce manufacturing cost, eliminate unnecessary consumption of material and protect environment, by providing a thin film which is formed by adhering a fluid which contains a dielectric material on a plane to be a base and solidifying it. SOLUTION: Semiconductor element manufacturing equipment is provided with ink jet type recording heads 21-2n (n is a discretionary natural number), tanks 31-3n, a driving mechanism 4 and a control circuit 5. The semiconductor element manufacturing equipment is constituted to be capable of forming a prescribed thin film by adhering the droplets 1x (x is 1-n) of a discretionary fluid on the surface of a substrate 1. The ink jet type recording heads 21-2n are provided with a same structure, respectively. Each head is constituted to be capable of jetting the fluid including a thin film material by ink jetting method. The tanks 31-3n respectively reserve the fluid 11-1n including a material for forming a semiconductor thin film and a dielectric thin film. The respective fluid 11-1n can be supplied to the ink jet type recording heads 21-2n through a pipe. |
