| 摘要 |
PROBLEM TO BE SOLVED: To enable shortening of a time for manufacturing an IC tag as well as printing operation at the same time as a molding operation. SOLUTION: In this manufacturing method, a molding apparatus, which has a stationary die 14 and a movable die 15 which form a predetermined shape cavity when dies are combined are used and also has an auxiliary die 17 in a cavity formation recess 14a of the stationary die 14 for changing the depth of the recess. In a condition in which the auxiliary die 17 is made to retreat from an end face of the stationary die 14 by a predetermined amount, an IC module sheet is first set on a bottom of the cavity formation recess 14a, a transfer film A is supplied onto a molding surface 15a, and molten resin is injected thereinto. Thereafter, in a condition in which the auxiliary die 17 is retreated by a predetermined amount, the molten resin is further injected, a molded product after the resin has set is removed from the cavity, a base material of the film A is removed from the molded product, thus manufacturing an IC tag, on which a predetermined figure or the like is transferred. |
