发明名称 APPARATUS AND METHOD FOR MEASURING THICKNESS OF THIN FILM AND METHOD AND APPARATUS FOR MANUFACTURING THIN FILM DEVICE USING THE SAME
摘要 <p>The thickness of a wide transparent film and the thickness distribution are precisely measured. For example, in CMP process, by measuring the thickness of the outermost layer formed on a stepped pattern of an actual product, a high-precision film-thickness control is realized; and in order to improve the process throughput, by providing a polisher with a film thickness measuring unit for measuring with high precision the thickness of an optically transparent film formed on the pattern of an actual device by frequency-analyzing the spectral distribution, a high-precision film-thickness control is realized and the process throughput is improved. A high-precision measuring method comprises frequency-analyzing the spectral distribution waveform of the interference light produced from white light because of a film, and determining the absolute value of the film thickness from the relationship between the phase of the frequency component included in the waveform and the film thickness.</p>
申请公布号 WO1999054924(P1) 申请公布日期 1999.10.28
申请号 JP1999002073 申请日期 1999.04.19
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