SEMICONDUCTOR PLASTIC PACKAGE

摘要

PROBLEM TO BE SOLVED: To improve the electric insulation and migration resistance after a pressure cooker by forming a plurality of truncated conical metal protrusions on a part of a metal foil of a printed wiring board and fixing a semiconductor chip onto these truncated conical metal protrusions and metal foil. SOLUTION: A metal plate (a) having approximately the same size as that of a printed wiring board is disposed approximately at the center of the printed wiring board thickness, a plurality of truncated conical metal protrusions are formed independently of a metal foil (d) on a part of the metal foil (d) to which a semiconductor chip is directly fixed and exposed or covered with a metal plating, and the semiconductor chip is fixed onto the truncated conical metal protrusions and the metal foil (d) through a heat-conductive adhesive. Thus it is possible to improve the popcorn phenomenon as well as the electric insulation and migration resistance after a pressure cooker.