PACKAGING FOR ENCAPSULATING MATERIAL

摘要

The packaging (1) for encapsulating material (9) comprises two films (2, 3) which wrap a volume of encapsulating material (9). Such packagings are used e.g., in transfer molding to encapsulate electronic components. End parts of the first film (2) are sealed together by two closure seams (4, 5). The two films (2, 3) are joined together by film seams (6, 7) which extend along from one closure seam (4, 5) to the other. The films (2, 3) form at least one two-layer film flap (A; B) through which during molding the encapsulating material flows into the runners of a mold. In the film flap(s) (A; B) at least one of the films is provided with one or more incisions (8; 15, 16, 18) located in the vicinity of at least one of the closure seams (4, 5) or, after cutout of a part of the film flaps (A; B), the oblong border (20) of the film flaps (A; B is shorter than the distance (21) between the two closure seams (4, 5). With the incisions the stresses induced by the closure seams (4, 5) in the film flaps (A; B) and therefore undesired creases and corrugations are eliminated.