发明名称 |
Apparatus and method for contact failure inspection in semiconductor devices |
摘要 |
There is provided a contact failure inspection system and method for semiconductor devices and a method of manufacturing semiconductor devices. Using digitized values for electron signals detected using a scanning electron microscope, contacts can be inspected to identify failures such as non-open contact holes. The contact failure inspection is performed by comparing the electron signal value detected from a unit area including at least one contact hole with values representative of the electron signal corresponding to a normal contact. The electron signal 13 compared with an allowable range of values and the status of the contact hole, ie: open or non-open, 13 classified in accordance with the comparison. |
申请公布号 |
IL127356(D0) |
申请公布日期 |
1999.10.28 |
申请号 |
IL19980127356 |
申请日期 |
1998.12.01 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
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分类号 |
H01L21/66;G01R1/06;G01R31/02;G01R31/302;G01R31/307;H01J37/22;H01J37/28 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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