Epoxy resin composition, useful for encapsulation of semiconductor devices

摘要

An epoxy resin composition for sealing and/or encapsulating semiconductor elements comprises epoxy resin, a hardener, a silane coupling agent and a release agent. An epoxy resin composition for sealing and/or encapsulating semiconductor elements comprises (A) an epoxy resin (B) a hardener (C) a silane coupling agent having an epoxy, mercapto or amine group and (D) a release agent whose molecular structural units are of formula -(CH2CH2)m- (I) and -(CH2CH2O)n- (II) whereby the content of units of formula (II) is 25-95 wt.% . An Independent claim is included for a semiconductor device encapsulated with (I). m = 8-100; n = greater than 0.