发明名称 ORGANIC ACIDS ACTIVATED LOW RESIDUE NO CLEAN SOLDER FLUX COMPOSITION
摘要 A blend mixture of non-toxic, non-corrosive liquid soldering flux consists essentially of a mixture of short-chain carboxylic acid derivatives of a short to medium-chain hydrocarbon, such as: adipic acid and formic acid in an organic solvent system consists of iso-propanol and ethyl acetate. Neither precleaning nor postcleaning of the pieces being joined is necessary. The flux evaporates completely upon heating, leaving no corrosive residue or other product on the surface of the piece. The composition comprises about, a) 60-95% by weight iso-propanol, b) 0-30% by weight ethyl acetate, c) 1-10% by weight formic acid, c) 0.5-8% by weight adipic acid, and d) 0-10% by weight acetic acid.
申请公布号 CA2230331(A1) 申请公布日期 1999.10.27
申请号 CA19982230331 申请日期 1998.04.27
申请人 LEUNG, DAVID WAI-YIN 发明人 LEUNG, DAVID WAI-YIN
分类号 B23K35/36;(IPC1-7):B23K35/363 主分类号 B23K35/36
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