| 摘要 |
An IC module (A) incorporated in an IC-card (B) includes a substrate (1), an IC chip (2) mounted on the substrate (1), and an antenna coil (3) electrically connected to the IC chip (2). The antenna coil (3) includes a conductive film which is patterned on a surface of the substrate (1), thereby facilitating fabrication of the IC module (A) while realizing a thickness reduction of the IC module. <IMAGE> |
