| 摘要 |
PROBLEM TO BE SOLVED: To manufacture an emboss carrier tape preventing the generation of cracks, breakages and the like on the tape at the time of releasing a top cover tape bonded on the upper face of the emboss carrier tape in the mounting and assembling process for the emboss carrier tape storing semiconductor devices. SOLUTION: When a frame section 3 holding a plurality of pocket sections 1 in which semiconductor devices 2 are stored is bonded with a top cover tape 1, and the shortest distance from the ends of pocket sections 7 to the end of the top cover tape 1 is set as L, the distance M between a bonding section 4 on which the top cover tape 1 is bonded on the frame 3 in the same direction and the ends of the pocket sections 7 is formed in the range of L×1/10 or longer to L×7/10 or shorter so that the vicinity of the ends of the pocket sections 7 are not bonded thereon.
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