| 摘要 |
PROBLEM TO BE SOLVED: To enhance using efficiency of a polishing pad by polishing the polishing object surface by opposing a small lightweight polishing pad holder fixing the polishing pad to the polishing object surface of a wafer. SOLUTION: A wafer 1 is held by one piece in a wafer holding part 2 by turning the polishing object surface upward. A polishing pad 4 is held on a polishing pad holder 9. Next, while dripping an abrasive on the polishing object surface, the polishing pad 4 is placed on the polishing object surface of the wafer 1, the wafer holding part 2 is slowly rotated, the polishing object surface is pressurized by the polishing pad 4, and while applying vibrational motion, the polishing object surface is polished. Since the size of the polishing pad 4 is formed in the size by adding two times amplitude of vibration of the polishing pad 4 to a dimension of the wafer 1, in a polishing process, the wafer 1 is always polished over the whole polishing object surface. Here, a rotating speed of the wafer 1 by the wafer holding part 2 is decided so that peripheral velocity on the outermost side of the wafer does not exceed an average speed by vibration of the polishing pad 4 at its maximum. |
