发明名称 Vacuum assisted debris removal system
摘要 A vacuum manifold having a rectangular opening with vacuum access bores connected into the rectangular opening for an illumination field to be projected there through. A vacuum manifold is placed between a photosensitive resist covered wafer and a lens element in a photolithographic tool. The relatively high illumination energy in an illumination field used for projecting an image of a reticle onto a photosensitive resist covered wafer often results in ablated, evaporated, and effused material being coated on the lens element. The vacuum manifold placed between the lens element and the photosensitive resist covered wafer creates an airflow for removing debris or contamination preventing coating of the lens surface. This prevents image quality from degradation over time, as well as reduces downtime needed for cleaning or maintenance of the photolithographic tool.
申请公布号 US5973764(A) 申请公布日期 1999.10.26
申请号 US19970878633 申请日期 1997.06.19
申请人 SVG LITHOGRAPHY SYSTEMS, INC. 发明人 MCCULLOUGH, ANDREW W.;OLSON, SEAN
分类号 G01N21/15;G03F7/20;H01L21/027;(IPC1-7):G01J1/00 主分类号 G01N21/15
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