发明名称 |
Contactless bonding tool heater |
摘要 |
In a pick and place machine of the type having an X-Y movable bond head there is provided a vertically movable pick up tool in the bond head having a tip for picking up and placing a device. The tip of the bonding tool is mounted opposite a radiant heating element which is juxtaposed and separated from the tip of the bonding tool. The tip of the bonding tool is heated to a predetermined control temperature with the radiant energy heating element and during a bonding operation it incurs some cooling. The amount of cooling is calculated by the time and the length of the extension of the bonding tool from its heating element and a computer controller calculates a compensation factor over a predetermined fixed time which includes retracting the bonding tool tip a predetermined vertical distance into the heater to reheat the tool and compensate for the amount of cooling that occurred during the pick and place operation. |
申请公布号 |
US5971250(A) |
申请公布日期 |
1999.10.26 |
申请号 |
US19990281649 |
申请日期 |
1999.03.30 |
申请人 |
QUAD SYSTEMS CORP. |
发明人 |
SAFABAKHSH, ALI REZA;KILGARRIFF, JOHN JOSEPH |
分类号 |
B23K1/005;B23K3/04;B23K20/00;H05K13/04;(IPC1-7):B23K37/04;B23K37/047 |
主分类号 |
B23K1/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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