Moisture-curing sealing and bonding compound

摘要

PCT No. PCT/EP96/01512 Sec. 371 Date Oct. 15, 1997 Sec. 102(e) Date Oct. 15, 1997 PCT Filed Apr. 9, 1996 PCT Pub. No. WO96/33249 PCT Pub. Date Oct. 24, 1996Described is a moisture-curing sealing and bonding compound made from completely synthetic polymers, the compound containing, to improve its non-sag properties, a triglyceride, either as the sole non-sag agent or in addition to prior art agents. The triglyceride should have a melting point over 40 DEG C., preferably over 50 DEG C., and be derived from saturated fatty acids with 8 to 26 C-atoms. Even without using thixotropic agents, compounds can be obtained which do not sag at temperatures over 40 DEG C. Such joint sealants can be used to fill joints more than 35 mm wide without sagging.