发明名称 |
Apparatus and method for continuous casting solder onto discrete parts |
摘要 |
An apparatus and method are provided for continuously injecting molten solder into a plurality of molds for transfer of the formed solder mounds to electronic devices such as multilayer ceramic packages. A conventional injection molding apparatus is employed with a specially designed apparatus for forming the molds and preferably with a specially designed mold to provide a continuous molding process. The apparatus is preferably of a U-shaped configuration whereby molds are advanced under the molten solder reservoir and injection head by a preceding mold in the apparatus. The urging action of the preceding mold on the succeeding mold and, preferably in conjunction with the preferred mold design, enables a continuous method and apparatus for injecting molten solder into a plurality of molds. The preferred mold design utilizes an upper plate having mold opening, and a lower substrate or backing plate, with the length and width of the upper plate being slightly longer than the length and width of the lower substrate or late.
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申请公布号 |
US5971058(A) |
申请公布日期 |
1999.10.26 |
申请号 |
US19970876140 |
申请日期 |
1997.06.13 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BOLDE, LANNIE R.;COVELL, II, JAMES H. |
分类号 |
B23K3/06;H05K3/34;(IPC1-7):B22D33/04 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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