发明名称 Packaging power converters
摘要 A package for power converters in which a multilayers circuits board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some portion of the bottom layer are also support for electronic components. Some of the components are placed on the top layer, which may not be utilized for magnetic winding, reducing the footprint of the magnetic elements to the footprint of the magnetic core. The power dissipating devices placed on pads which have a multitude of copper coated via connecting the top to bottom layers. Through these via the heat is transferred from the power devices to the other side of the PCB. In some of the embodiment of this invention the heat can be further transferred to a metal plate connected to the multilayers circuit board via a thermally conductive insulator. The baseplate has cutouts or cavities to accommodate the magnetic cores. A thermally conductive is placed between the magnetic core and the metal plate on the bottom of the cavity.
申请公布号 US5973923(A) 申请公布日期 1999.10.26
申请号 US19980086365 申请日期 1998.05.28
申请人 JITARU, IONEL 发明人 JITARU, IONEL
分类号 H01F27/06;H05K1/02;H05K1/05;H05K1/16;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01F27/06
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