| 摘要 |
PROBLEM TO BE SOLVED: To obtain an insulating material useful for electronic device having electronic members or semiconductor devices and exhibiting high moisture resistance and constant relative dielectric constant in a relatively high relative humidity atmosphere and stable in re-flowing by using a hot-melt liquid crystalline polymer. SOLUTION: This insulating material uses a hot-melt liquid crystalline polymer, e.g. an Ekonol (R) type polyester-based main chain type liquid crystalline polymer of the formula having about (1-10)×10<4> molecular weight, etc. In the semiconductor device at least having a semiconductor element wherein electronic circuits and outside electrodes are formed, wiring patterns to be connected with the outside electrodes and a substrate loading them, the polymer is preferably used as insulating materials and insulating supporters, the substrate material, or the insulating materials and the insulating supporters between the semiconductor chips and the wiring patterns and the substrate. |
