Apparatus for areally pressing together wafer-type (slice- type, disk-shaped) elements, so-called wafers, that are to be connected in the fabrication of semiconductor modules,申请号AT19980000707-传众专利搜索

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发明名称	Apparatus for areally pressing together wafer-type (slice- type, disk-shaped) elements, so-called wafers, that are to be connected in the fabrication of semiconductor modules
摘要
申请公布号	AT405700(B)	申请公布日期	1999.10.25
申请号	AT19980000707	申请日期	1998.04.28
申请人	THALLNER ERICH DIPL.ING.	发明人
分类号	H01L21/00;(IPC1-7):H01L21/00;B32B31/20	主分类号	H01L21/00
代理机构		代理人
主权项
地址

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