| 摘要 |
<p>A method and system (68) for fabricating electronic assemblies (22), such as multi chip modules, which include wire bonded semiconductor dice (12), are provided. Initially, dice (12) having bond pads (14), and a substrate (10) having corresponding bond pads (20), are provided. Using a wire bonding process, bonded connections (34, 36) are made between the bond pads (14) on the dice, and the bond pads (20) on the substrate (10). During the wire bonding process, electrical continuity in the bonded connections (34, 36) can be evaluated. Following wire bonding, but prior to subsequent processing of the assemblies (22), quick functionality tests can be performed to evaluate other electrical characteristics of the assemblies (22) (e.g., gross fucntionality, open/short, pad leakage, cell defects). This permits defective assemblies (22) to be identified prior to further processing. Once the assemblies (22) have been completed, full functionality and parametric tests can be performed. A system (68) for performing the method includes a conventional wire bonder (70); a tester (24) having test circuitry (46) for performing the required tests; and an electrical connector (26) for establishing temporary electrical communication with the assembly (22).</p> |
