发明名称 |
Resin-bound polishing material for polishing semi-conductor wafers and glass fiber end faces |
摘要 |
A resin-bound polishing material (I) is prepared by mixing an aqueous suspension of a colloidal polishing agent with a higher alcohol, followed by evaporation of water from the mixture such that the colloidal polishing agent containing alcohol polymerizes and is applied as a layer to a substrate and hardened.
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申请公布号 |
DE19817555(A1) |
申请公布日期 |
1999.10.21 |
申请号 |
DE19981017555 |
申请日期 |
1998.04.15 |
申请人 |
OTTOW, MANFRED |
发明人 |
OTTOW, MANFRED |
分类号 |
C08G63/49;C08J5/14;C09G1/02;C09K3/14;G02B6/38;(IPC1-7):C08J5/14;B24B9/14;C08K3/36;C09G1/16;C30B33/00;H01L21/302 |
主分类号 |
C08G63/49 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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