| 摘要 |
A method of manufacturing a compact module by means of surface-mount-device (SMD) technology, in which component (2-5) are applied and contacted unilaterally on a circuit board (1) coated on one side, or on both sides with an electrically conductive material. The circuit board (1) is separated along a nominal fracture line (8) into discrete boards (6,7,15,16,21,22) whose non-equipped surfaces join together facing one another, and the applied electrical pluggable elements (12,13) are electrically and mechanically joined in the edge zone of the discrete boards.
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