| 发明名称 |
WÄRMEBESTÄNDIGER KLEBEFILM FÜR LEITERPLATTEN UND DESSEN VERWENDUNGSVERFAHREN |
| 摘要 |
<p>A heat-resistant adhesive film for printed boards which has silicon units and comprises a polyimide resin and an epoxy resin. The film may contain, if necessary, an epoxy resin curing agent and a polyimide resin structure may have a functional group reactive with the epoxy resin. It is used by interposing between the adherents and applying a pressure of 1-1,000 kg/cm<2> at a temperature of 20-250 DEG C. This film is excellent in heat resistance, wet soldering-heat resistance and processability under a thermal pressing condition below 250 DEG C.</p> |
| 申请公布号 |
DE69323899(T2) |
申请公布日期 |
1999.10.21 |
| 申请号 |
DE1993623899T |
申请日期 |
1993.12.27 |
| 申请人 |
NIPPON STEEL CHEMICAL CO., LTD. |
发明人 |
OHMORI, FUMIHIRO;WADA, YUKIHIRO;YUASA, MASATOSHI;WADA, KEIICHIROU;SHIMOSE, MAKOTO;NAKAJIMA, KENJI;OHKUBO, MISAO |
| 分类号 |
C08G73/10;B32B7/12;C08L63/00;C08L79/08;C08L83/10;C09J5/06;C09J7/00;C09J163/00;C09J179/08;C09J183/10;H05K3/28;H05K3/38;H05K3/46;(IPC1-7):C09J7/00;C09J183/04 |
主分类号 |
C08G73/10 |
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