Semiconductor element separation and positioning method

摘要

The semiconductor element separation and positioning method uses a carrier foil (5) to which a number of semiconductor elements (S) are temporarily attached, positioned to bring at least one component (13) into alignment with a component carrier (14). The component is then separated from the foil by a die stamp (18) acting against the rear side of the latter. The components may be secured to the carrier foil by an adhesive layer (23)with its adhesion characteristics reduced upon application of energy via the die stamp, for removal of the positioned component.