| 摘要 |
An electronic device package in the form of a ball grid array package is formed adding a single layer of conductive material including circuitry having trace lines, wire bond pads, and solder ball pads electrically coupled together. Thin film circuitization techniques are used on a polyimide laminate substrate to accommodate greater than 100 input/output contacts of an electronic device on a single layer. Thus, the package will not have vias or other conductive type through holes as in multiple conductive layer ball grid array packages.
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