| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for mounting electronic components and a method for mounting electronic components, using a multiple type heat part by which a time required for picking up electronic components can be reduced and the mounting speed can be made higher. SOLUTION: A sub transfer head 29 picks up electronic components Q1 to Q3 in a tray 25 and transfers them to an auxiliary table 20. In this case, it transfers them thereto at the same pitch as that of the nozzle of the respective head of a head part 30. The head part 30 picks up the electronic components Q1 to Q3 on the auxiliary table 20 and moves them to the upper side of a recognizing device 40 on its side, and after recognizing the positions of the electronic components Q1 to Q3, the head part 30 moves them to the upper side of a substrate 1 and mounts them thereto. |
