SPACER STRUCTURE AND HIGH-DENSITY MUTUAL CONNECTION STRUCTURE HAVING AIR GAP

摘要

PURPOSE: To provide a high-density mutual connection structure having an air dielectric disposed above an overlay sensitive part of an integrated circuit or another part. CONSTITUTION: A spacer structure 344 disposed above an electronic part 332 separates a dielectric 346 of a high-density mutual connection structure 300 sufficiently from a surface of the electronic part, and a relatively large dielectric constant of a polymer dielectric layer of the structure 300 is set at such a level as to minimize the influences on operating characteristics of the electronic part 332. Thereby the high frequency electronic part 332 connected to another part through the high-density mutual connection structure 300 is surrounded by an air dielectric constant of the interior of the structure 300.