发明名称 SUBSTRATE SURFACE TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To easily take out a surface-treated substrate, regardless of the size of the substrate which can be positioned easily. SOLUTION: In this method, an elastic substrate 2 is placed on a table 1, the substrate 2 is surface-treated, and then the substrate 2 is taken out from the table 1. The surface of the table 1 has an arc-shaped recessed shape. For surface treatment, the substrate 2 is deflected into an arc shape along the arc- shaped recessed surface 11 of the table 1. Then, the substrate 2 is surface- treated. Subsequently, the substrate 2 is formed almost rectilinear by coursing the deflection to be eliminated. Then, the side face 21 of the substrate 2 is held by a chuck, and the substrate is taken out from the table 1.
申请公布号 JPH11289148(A) 申请公布日期 1999.10.19
申请号 JP19980107056 申请日期 1998.04.02
申请人 IBIDEN CO LTD 发明人 DEMURA AKIHIRO;YAMADA KOJI
分类号 B41F15/08;B23K26/00;B41F15/26;H05K3/00;H05K3/28;(IPC1-7):H05K3/00 主分类号 B41F15/08
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