Printed wiring board assemblies

摘要

A method of manufacturing a high-performance printed wiring board assembly, and the resulting product, utilize a substrate component that has a reinforcement material embedded in a condensation-reacted and thermally-crosslinked nadic end-capped polyimide resin electrically conductive lamina component pathways directly adhered to the substrate component resin and high-temperature soldered or otherwise attached connections that electrically join the conductor leads of included electrical devices to the lamina component conductive pathways.