| 发明名称 |
Device and method for preventing settlement of particles on a chemical-mechanical polishing pad |
| 摘要 |
A device and method for preventing settlement of particles on a chemical-mechanical polishing pad is provided. Specifically, a device capable of preventing settlement of particles on the pad is located between the polishing pad and a platen of a chemical-mechanical polishing apparatus.
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| 申请公布号 |
US5968841(A) |
申请公布日期 |
1999.10.19 |
| 申请号 |
US19970851920 |
申请日期 |
1997.05.06 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LANDERS, WILLIAM FRANCIS;LOFARO, MICHAEL FRANCIS;TICKNOR, ADAM DAN |
| 分类号 |
B24B37/00;B24B1/04;B24B37/04;H01L21/304;(IPC1-7):H01L21/00 |
主分类号 |
B24B37/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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