| 摘要 |
PURPOSE:To mount a power monotype semiconductor element in which a power circuit and a small signal circuit are made into a one chip. CONSTITUTION:A plurality of circuit elements are connected on a conductive path 3 formed on one main surface of a metal substrate formed through an insulating layer, an earth line or a power supply line of the conductive path 3 are electrically connected to the metal substrate 1 by a connection means 4, a power circuit part and a small signal group circuit part driving said power circuit part is made into a monolithic integrated circuit while ground potential is connected to the pads in the peripheries of a relatively thin wire 7 for a smal signal group circuit and a relatively thick wire 6 loaded on the metal substrate 1 with no mediation of an insulation layer 1. |
