发明名称 |
RESIN COMPOSITION FOR HIGH-FREQUENCY CONTACT POINT AND HIGH-FREQUENCY PROPAGATING COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To obtain a composition which can give a high-frequency contact point having excellent electric conductivity nearly equivalent to that of a metal at a high frequency of a specified MHz or above and being capable of being inexpensively producible even when it is complicated in shape by mixing a resin with a filler. SOLUTION: There is provided a composition for a contact point for use at a high frequency of 10 MHz or above. The resin used as a matrix resin may be a resin material having a resistance value of 1×10<10>Ωcm or above. Among such resins, a thermoplastic resin is desirable. The conductive filler is particularly desirably a short-fiber-like filler, below. Further, it is desirably one having an average fiber diameter of 50μm or below. The filling ratio of the conductive filler is usually 1-200 pts.vol. per 100 pts.vol. matrix. It is desirable that the resistance value of the composition is such that the absolute value of its impedance to a 10 MHz signal is 100Ωor below.
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申请公布号 |
JPH11286609(A) |
申请公布日期 |
1999.10.19 |
申请号 |
JP19980090019 |
申请日期 |
1998.04.02 |
申请人 |
MITSUBISHI CHEMICAL CORP;YUKA DENSHI KK |
发明人 |
SAGISAKA KOICHI;TAKASHIMA MASATAKE;KANIWA TOMOHIRO;SATO MITSUO |
分类号 |
C08K7/06;C08L101/00;H01B1/22;(IPC1-7):C08L101/00 |
主分类号 |
C08K7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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