发明名称 Lateral thin-film SOI devices with graded top oxide and graded drift region
摘要 A lateral thin-film Silicon-On-Insulator (SOI) device includes a lateral semiconductor device such as a diode or MOSFET provided in a thin semiconductor film on a thin buried oxide. The lateral semiconductor device structure includes at least two semiconductor regions separated by a lateral drift region. A top oxide insulating layer is provided over the thin semiconductor film and a conductive field plate is provided on the top oxide insulating layer. In order to provide enhanced device performance, a portion of the top oxide layer increases in thickness in a substantially continuous manner, while a portion of the lateral drift region beneath the top oxide layer decreases in thickness in a substantially continuous manner, both over a distance which is at least about a factor of five greater than the maximum thickness of the thin semiconductor film.
申请公布号 US5969387(A) 申请公布日期 1999.10.19
申请号 US19980100832 申请日期 1998.06.19
申请人 PHILIPS ELECTRONICS NORTH AMERICA CORPORATION 发明人 LETAVIC, THEODORE;SIMPSON, MARK
分类号 H01L21/336;H01L27/12;H01L29/06;H01L29/08;H01L29/40;H01L29/423;H01L29/78;H01L29/786;H01L29/861;(IPC1-7):H01L27/12 主分类号 H01L21/336
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