| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to enhance the heat dissipation property of a radiating member, by a method wherein the heat spreader of the radiating member constituted by forming integrally the heat spreader and reinforcing bodies is bonded to the bottom of a semiconductor element, and the reinforcing bodies of the radiating member are bonded to the bottom of a film circuit. SOLUTION: As a radiating member 8, a high heat conductivity metal such as aluminum or copper, is used, and the radiating member is constituted by forming integrally a heat spreader 9 and reinforcing sheets 10 by a die molding using a power metallurgy method. Grooves 21 are formed in the bottom of the heat spreader 9 of the radiating member 8 to widen the surface area of the bottom of the spreader 9 for enhancing the heat dissipation property of the radiating member. In such a way, as the radiating member 8 is constituted by forming integrally the spreader 9 and the reinforcing bodies 10, a high heat resistance one of a bonding agent is not interposed between the spreader 9 and the bodies 10. Accordingly, even if heat transferred to the spreader 9 of the radiating member passes through a reinforcing member, the heat is effectively dissipated to the outside, and the heat dissipation property of the radiating member is enhanced higher than that of a conventional radiating member.</p> |
