| 摘要 |
PROBLEM TO BE SOLVED: To easily position a semiconductor device on a printed board, by respectively passing the two lead sections of a semiconductor device mounting, and positioning jig through holes formed through the semiconductor device in the thickness direction near the two diagonal corners of the device. SOLUTION: A semiconductor device mounting and positioning jig 10 is formed in a cramp-like shape and provided with a main body 9 and lead sections 11 and 11 provided to both ends of the lower surface section of the main body 9. Near the two diagonal corners of a QFP 12, hole sections 13 and 13 are formed through the QFP 12 in the thickness direction. The jig 10 is attached to the QFP 12 by passing the lead sections 11 and 11 of the jig 10 through the hole sections 13 and 13. On a printed board 15, recessed sections 16 and 16 into which the lead sections 11 and 11 are put are formed correspondingly to the position of a wiring pattern 17. After the QFP 12 is temporarily fixed on the printed board 15 by inserting the lead sections 11 and 11 in the recessed sections 16 and 16, the QFP 12 is fixed by soldering the QFP 12 to the board 15. |
