发明名称 |
Method for etching a compound semiconductor, a semi-conductor laser device and method for producing the same |
摘要 |
An etching method for performing dry-etching on a III-V group compound semiconductor or a II-VI group compound semiconductor in a dry-etching apparatus comprising a plasma source for creating a plasma of density of about 1010 cm-3 or greater, using a mixed gas containing a gas including a halogen element and a gas including nitrogon. The etching conditions are as follows: (a flow rate of the gas containing said halogen gas)/(a flow rate of said nitrogen gas) >/=1; and an internal pressure during etching reaction is about 1 mTorr or greater.
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申请公布号 |
US5968845(A) |
申请公布日期 |
1999.10.19 |
申请号 |
US19970796194 |
申请日期 |
1997.02.07 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
CHINO, TOYOJI;KUMABUCHI, YASUHITO;KIDOGUCHI, ISAO;ADACHI, HIDETO |
分类号 |
H01L21/306;H01L21/473;H01S5/10;H01S5/20;H01S5/223;H01S5/227;H01S5/323;(IPC1-7):H01L21/20 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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