发明名称 Method for etching a compound semiconductor, a semi-conductor laser device and method for producing the same
摘要 An etching method for performing dry-etching on a III-V group compound semiconductor or a II-VI group compound semiconductor in a dry-etching apparatus comprising a plasma source for creating a plasma of density of about 1010 cm-3 or greater, using a mixed gas containing a gas including a halogen element and a gas including nitrogon. The etching conditions are as follows: (a flow rate of the gas containing said halogen gas)/(a flow rate of said nitrogen gas) >/=1; and an internal pressure during etching reaction is about 1 mTorr or greater.
申请公布号 US5968845(A) 申请公布日期 1999.10.19
申请号 US19970796194 申请日期 1997.02.07
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 CHINO, TOYOJI;KUMABUCHI, YASUHITO;KIDOGUCHI, ISAO;ADACHI, HIDETO
分类号 H01L21/306;H01L21/473;H01S5/10;H01S5/20;H01S5/223;H01S5/227;H01S5/323;(IPC1-7):H01L21/20 主分类号 H01L21/306
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