| 摘要 |
PROBLEM TO BE SOLVED: To realize the formation of a mechanically and electrically superior alloy of an electrode pad or an inner lead part and a bonding wire in the joint of the bonding surface of the electrode pad or the inner lead part with the bonding wire. SOLUTION: Before a metal wire is brought into contact with an electrode pad 25 or an inner lead part 26, a scrubbing operation in advance for grinding to bonding surface of the bonding position on the pad 25 or the inner lead part 26, which is made a wire-bonding connection, using a tool 10 for bonding the surface residue removal, which is entirely different from a tool for bonding, is previously conducted in a state in which the bonding surface is pressed to a projection part by a prescribed pressure and is brought into contact with the projection part, and foreign substances 21 on the bonding surface are removed. |
