Method of attaching a chip to a flexible substrate

摘要

There is disclosed herein an electronic circuit, one embodiment of which comprises: an electronic component 10 having bump terminations 12 on a first surface 14 thereof; a flexible substrate 16 having a plurality of generally round holes 18 therein arranged in correspondence with the bump terminations, wherein each hole has a diameter d smaller than the diameter D of a corresponding bump termination; and an array of conductive circuit traces 20 arranged on a second surface 22 of the substrate, wherein each of the circuit traces terminates generally about one of the holes in the substrate. Each bump termination 12 is fixably inserted into its corresponding substrate hole 18 so as to mechanically connect the electronic component 10 with the substrate 16 and to electrically connect each termination 12 with a corresponding circuit trace 20.