| 摘要 |
A cleaning mechanism and method for cleaning the probe needles of a probe card used for the inspection of the electric characteristics of a wafer W. This mechanism is provided with a soft cleaner and a brush cleaner. The soft cleaner has a cleaner layer formed of rubber and inorganic filler. The brush cleaner has a number of brush sections, and each brush section is a bundle of fiber members. The fiber members are thinner than the probe needles and have a certain degree of elasticity. The cleaning method includes the steps of: a) cleaning the probe needles using the soft cleaner having a the cleaning layer made of rubber and inorganic filler and b) cleaning the probe needles using the brush cleaner having bristles.
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