Method of manufacturing an integrated circuit using chemical mechanical polishing

摘要

A method of manufacturing integrated circuits using a carrier fixture. The carrier fixture does not include transport channels or openings for directing a slurry to a substrate being polished and, as a result, damage to the substrate is reduced because the edges adjacent to the substrate are eliminated. The present invention further provides a carrier fixture having an inner support coupled to a ring member that contacts a substrate during the CMP process. The present invention also provides a carrier fixture having inner and outer supports coupled to a ring member.