发明名称 |
Method of molding free-floating insert |
摘要 |
A method (60) for molding (67) a component (73) including a free floating insert (11). The method includes steps of providing an insert (11) including one or more weakened regions (23) coupled to a removable leader (20) and molding (67) a moldable compound (25) about the insert (11) and a portion of the removable leader (20). The method (60) further includes a step of pulling (69) on the removable leader (20) to fracture the weakened regions (23) and thereby detach the removable leader (20) from a molded component (73) including the insert (11) therein. The molding step (67) desirably includes a step of injection molding (67) a thermoplastic material (25) about the insert (11) and the portion of the removable leader (20).
|
申请公布号 |
US5966799(A) |
申请公布日期 |
1999.10.19 |
申请号 |
US19970831118 |
申请日期 |
1997.04.01 |
申请人 |
MOTOROLA, INC. |
发明人 |
UNDERSTILLER, WADE NORMAN;ROCHE, THOMAS ANDREW;FULLER, RONALD DEE |
分类号 |
B29C45/14;B29C70/68;B29C70/70;H05K3/20;(IPC1-7):H01P11/00 |
主分类号 |
B29C45/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|